Cree XLamp?優化LED PCB的熱性能

　　1。介紹

　　這個設計筆記概述協助開發成本有效的熱管理XP和XLamp LED MX家庭技術。

　　LED照明系統中最關鍵的設計參數之一是該系統能夠將熱量從LED接點中分離出來。LED連接處的高工作溫度對發光二極管的性能產生不利影響，導致光輸出和壽命縮短1。為了正確地管理這種熱量，照明應用中LED的設計、組裝和操作應遵循特定的做法。

　　本應用說明概述了一種設計低成本印刷電路板（PCB）布局的技術，它優化了LED的熱量傳遞。該技術涉及使用的多氯聯苯的FR-4為基礎，成本較低，但比金屬芯印刷電路板（MCPCB）更大的熱阻。使用金屬內襯孔或通孔的下面是一個LED的散熱墊散熱通過fr-4-pcb和成適當的散熱方法。

　　Using metalized vias is a technique available to the LED packaging used by Cree XLamp LEDs. Electrically isolated thermal pads are a requirement for using this technique. For certain illumination systems design， thermal vias enable the use of FR-4 circuit boards over metal core circuit boards. This can deliver system cost savings in circuit board and heat sink selection.

　　This application note serves as a practical guideline based on heat transfer fundamentals and includes suggestive， but not definitive， simulation and measurement data. Cree advocates this technique as appropriate design for certain lighting applications and encourages Cree’s customers to evaluate this option in considering the many thermal management techniques available. For additional guidelines on LED thermal management refer to application note， Cree XLamp LED Thermal Management.